| 图片 | 零件号 | 品牌 | 描述 | 数量 | 购买 |
|---|---|---|---|---|---|
 | SAMSUNG | Package SMD or Through Hole SAMSUNG KLMAG4FEJA-A001 New original parts | 21832 pieces | ||
| EMMC | Package SMD or Through Hole EMMC KLMAG4FEJA-A002 New original parts | 40579 pieces | ||
| SAMSUNG | Package SMD or Through Hole SAMSUNG KLMAG8DEDD-B New original parts | 65515 pieces | ||
| SAMSUNG | Package BGA SAMSUNG KLMAG8DEDD-B010 New original parts | 10448 pieces | ||
| SAMSUNG | Package SMD or Through Hole SAMSUNG KLMAG8DEDD-B101 New original parts | 65515 pieces | ||
| SAMSUNG | Package SMD or Through Hole SAMSUNG KLMAG8DEDD-B101000 New original parts | 65510 pieces | ||
| SAMSUNG | Package BGA SAMSUNG KLMAG8DEFD-A301 New original parts | 10448 pieces | ||
| SAMSUNG | Package SMD or Through Hole SAMSUNG KLMAG8DEFD-A301000 New original parts | 65510 pieces | ||
| Samsung | Package SMD or Through Hole Samsung KLMAG8DEFD-A301T00 New original parts | 65510 pieces | ||
 | Samsung Semiconductor | eMMC 5.1 32 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production | 115810 pieces | ||
| Samsung Semiconductor | eMMC 5.0 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production | 109230 pieces | ||
| Samsung Semiconductor | eMMC 5.0 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C Mass Production | 128510 pieces | ||
| Samsung Semiconductor | eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production | 113305 pieces | ||
| Samsung Semiconductor | eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production | 110800 pieces | ||
| Samsung Semiconductor | eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production | 78115 pieces | ||
| Samsung Semiconductor | eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production | 119160 pieces | ||
| Samsung Semiconductor | eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production | 94350 pieces | ||
| Samsung Semiconductor | eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production | 109580 pieces | ||
| Samsung Semiconductor | eMMC 5.1 64 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Sample | 128935 pieces | ||
| Samsung Semiconductor | eMMC 5.1 64 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 1.0 mm -25 ~ 85 °C Mass Production | 114500 pieces |
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